Broadcom, a chip designer with offices in Irvine, announced a partnership with OpenAI to introduce an accelerator chip called Jalapeño.
The chip was manufactured to be used specifically for large language models (LLM) and was designed by OpenAI with partners Broadcom and Celestica, a Canadian electronics manufacturing firm.
“Our collaboration with OpenAI represents a fundamental commitment to scaling the physical infrastructure required for the next decade of AI,” Broadcom CEO and President Hock Tan said in a statement. “This is just the beginning of a multi-generation roadmap. By co-developing our industry-leading silicon directly with OpenAI, we are enabling the deployment of gigawatt scale data centers with Microsoft and other partners beginning in 2026.”
Initial deployment of the chip is scheduled for late 2026. Broadcom shares remain unchanged in midday trading at $381.12 apiece with a market cap of $1.8 trillion (Nasdaq: AVGO).
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